Thermally resilient conformal hybrid interconnects printed with Aerosol Jet

This study demonstrates an architecture that enables printed silver interconnects to traverse vertical step edges using a thin dielectric layer and compact corner fill, thereby preserving electrical performance after single exposures up to 300 °C and hundreds of thermal cycles, offering thermal durability beyond conventional photo-curable corner fill materials; this enhances the scalability of hybrid electronics and advanced packaging designs to complex topographies.