No. 21
2026-08-08
the AI pulse — brewed, not raw

AiPulse — Issue No. 21

 COVER

 Pulse

 At Work

Thermally resilient conformal hybrid interconnects printed with Aerosol Jet

This study demonstrates an architecture that enables printed silver interconnects to traverse vertical step edges using a thin dielectric layer and compact corner fill, thereby preserving electrical performance after single exposures up to 300 °C and hundreds of thermal cycles, offering thermal durability beyond conventional photo-curable corner fill materials; this enhances the scalability of hybrid electronics and advanced packaging designs to complex topographies.

 Global Lens

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